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HELIOS will demonstrate different routes of integration of photonics with electronics and make available an integrated design and fabrication chain with standard and generic processes that could be transferred to foundries.

The project comprises several sets of activities:

  • Development of high performance generic building blocks that can be used for a broad range of applications: WDM sources by III-V/Si heterogeneous integration, fast modulators and detectors, passive circuits and packaging
  • Building and optimization of the whole “food chain” to fabricate complex functional devices. Innovative routes towards integration of electronics and photonics will be explored, and more specifically it will focus on the combination of silicon and InP technology on an electronics CMOS wafer. Photonics/electronics convergence will be addressed at the process level and also at the design level since HELIOS will contribute to the development of an adequate design environment
  • Demonstrating the power of this proposed “food chain” by realizing several complex photonic IC’s addressing different industrial needs.
  • Investigation of more promising but challenging alternative approaches. These concepts offer clear advantages in terms of integration on CMOS for the next generation of CMOS Photonics devices. Two main tracks will be followed to develop these concepts: the use of silicon related materials as active materials and a generic architecture (2.5D approach) for the III-V / Si heterogeneous integration of active devices on CMOS.
  • Road mapping, dissemination and training, to strengthen the European research and industry in this field and to raise awareness of new users about the interest of CMOS Photonics.

As described in the figure below, different integration options are considered :

Activities - illustration 1