HELIOS will tackle a range of hard tasks remaining to be completed for the deployment of CMOS photonics.
It includes the development of such essential building blocks as efficient sources (Silicon-based and heterogeneous integration of III-V on silicon), fast modulators and, beyond, the combination and packaging of these building blocks for the demonstration of complex functions, addressing a variety of industrial needs:
Several major breakthroughs are expected in HELIOS:
Even if the primary targeted applications are in the communication domain, the results of HELIOS will pave the way for applications of CMOS photonics for other fields, eg sensors or optical processing. HELIOS will make integration technologies accessible for a broad circle of users in a foundry-like, fabless way