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Expected outcomes

HELIOS will tackle a range of hard tasks remaining to be completed for the deployment of CMOS photonics.

It includes the development of such essential building blocks as efficient sources (Silicon-based and heterogeneous integration of III-V on silicon), fast modulators and, beyond, the combination and packaging of these building blocks for the demonstration of complex functions, addressing a variety of industrial needs:

  • a 40Gb/s modulator on a EIC
  • a 10x10 Gb/s transceiver,
  • a Photonic QAM-10Gb/s wireless transmission system
  • a mixed analog and digital transceiver module for multifunction antennas.

Several major breakthroughs are expected in HELIOS:

  • The integration of photonic active and passive functions with CMOS circuitry, to achieve a high level of functional integration and again an overall cost and size reduction.
  • Demonstration of highly integrated circuits addressing industrial needs. These components will be fabricated on 200mm CMOS pilot lines operated by the partners.

Even if the primary targeted applications are in the communication domain, the results of HELIOS will pave the way for applications of CMOS photonics for other fields, eg sensors or optical processing. HELIOS will make integration technologies accessible for a broad circle of users in a foundry-like, fabless way