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Technische universitaet Berlin

Overall presentation

TU Berlin has extended experience in Silicon photonics PLC research, SOI motherboard technology, and AuSn flip-chip assembly. Within federal projects TU Berlin was strongly involved in development of several integrated components for optical communication for high data rates. In addition to the above, an extended background exists at TUB for fiber link simulation, numerical analysis of non-linear impairments for high-speed optical links, and pre-compensation. TU Berlin has been coordinating a joint research activity with the NoE ePIXnet since 2004, and the Photonic Packaging Technology Platform since 2006.

The Berlin Center of Advanced Packaging (BeCAP) is a cooperation between the Forschungsschwerpunkt Technologien der Mikroperipherik of the Technische Universität Berlin (TUB-MP) and the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (Fraunhofer IZM). TUB-MP works in the field of fundamental research. Fraunhofer IZM transfers results by applied research to products and product technologies. Both are working closely with industrial enterprises. The cooperation between TUB-MP and Fraunhofer IZM results in a common use of equipment, facilities and infrastructure and in the cooperation in research projects

Activities within HELIOS

Within HELIOS TUB-MP will develop and demonstrate a generic approach for coupling a fiber array to a silicon photonic module. TUB-MP will in addition investigate the merge of electronics and photonics integration.

Further information

For BeCAP, and TUB-MP please visit http://www.becap.de

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